july 2011 doc id 12634 rev 2 1/8 8 bat48 small signal schottky diode features low leakage current losses negligible switching losses low forward and reverse recovery times extremely fast switching surface mount device low capacitance diode description the bat48 series uses 40 v schottky barrier diodes packaged in sod-123, sod-323 or do-35. this series is general purpose and features very low turn-on voltage and fast switching. table 1. device summary symbol value i f 350 ma v rrm 40 v c (typ) 18 pf t j (max) 150 c sod-123 sod-323 BAT48ZFILM (single) bat48jfilm (single) bat48rl configurations in top view band indicates cathode k a www.st.com
characteristics bat48 2/8 doc id 12634 rev 2 1 characteristics table 2. absolute ratings (limiting values at t j = 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 40 v i f continuous forward current 350 ma i fsm surge non repetitive forward current t p = 10 ms sinusoidal sod-123, sod-323 2 a do-35 7.5 t stg storage temperature range -65 to +150 c t j maximum operating junction temperature range sod-123, sod-323 -40 to +150 c do-35 -40 to +125 t l maximum temperature for soldering during 10 s sod-123, sod-323 260 c do-35 at 4 mm from case 230 table 3. thermal parameters symbol parameter value unit r th(j-a) junction to ambient (1) 1. epoxy printed ci rcuit board with recommended pad layout sod-123 500 c/w sod-323 550 r th(j-l) junction to lead (2) 2. on infinite heatsink with 4 mm lead length do-35 300 c/w
bat48 characteristics doc id 12634 rev 2 3/8 table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit v br breakdown reverse voltage t j = 25 c i r = 25 a 40 v i r (1) reverse leakage current t j = 25 c v r = 1.5 v 1 a v r = 10 v 2 v r = 20 v 5 v r = 40 v 25 t j = 60 c v r = 1.5 v 10 v r = 10 v 15 v r = 20 v 25 v r = 40 v 50 v f (2) forward voltage drop t j = 25 c i f = 0.1 ma 0.25 v i f = 1 ma 0.3 i f = 10 ma 0.4 i f = 50 ma 0.5 i f = 200 ma 0.75 i f = 500 ma 0.9 1. pulse test: t p = 5 ms, < 2 % 2. pulse test: t p = 380 s, < 2 % table 5. dynamic characteristics symbol parameter test conditions min. typ. max. unit c diode capacitance v r = 0 v, f = 1 mhz 30 pf v r = 1 v, f = 1 mhz 18 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 1) 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 p(w) t =tp/t tp = 1 = 0.05 i (a) f(av) = 0.1 = 0.2 = 0.5 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0 25 50 75 100 125 150 i (a) f(av) t (c) amb t =tp/t tp
characteristics bat48 4/8 doc id 12634 rev 2 figure 3. reverse leakage current versus reverse applied voltage (typical values) figure 4. reverse leakage current versus junction temperature (typical values) 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 0 5 10 15 20 25 30 35 40 i (a) r v (v) r t =25c j t =125c j t =100c j t =75c j t =50c j 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 0 25 50 75 100 125 i (a) r t (c) j v =40v r figure 5. junction capacitance versus reverse applied voltage (typical values) figure 6. forward voltage drop versus forward current (typical values) 0 5 10 15 20 25 30 35 0 5 10 15 20 25 30 35 40 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 0.0 0.2 0.4 0.6 0.8 1.0 i (a) fm v (v) fm t =125c j t =25c j figure 7. relative variation of thermal impedance junction to ambient versus pulse duration (sod-323) figure 8. thermal resistance junction to ambient versus copper surface under each lead (sod-323) 0.01 0.10 1.00 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 z/r th(j-a) th(j-a) sod-323 epoxy fr4 s = 2.25 mm e = 35 m cu 2 cu single pulse t (s) p epoxy fr4 with recommended pad layout, e = 35 m cu 300 350 400 450 500 550 600 0 5 10 15 20 25 30 35 40 45 50 s (mm2) cu r (c/w) th(j-a) printed circuit board, epoxy fr4, e =35 m cu
bat48 package information doc id 12634 rev 2 5/8 2 package information epoxy meets ul94,v0 lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. sod-123 footprint, dimensions in mm (inches) table 6. sod-123 dimensions ref. dimensions millimeters inches min. max. min. max. a 1.45 0.057 a1 0 0.1 0 0.004 a2 0.85 1.35 0.033 0.053 b 0.55 typ. 0.022 typ. c 0.15 typ. 0.039 typ. d 2.55 2.85 0.1 0.112 e 1.4 1.7 0.055 0.067 g0.25 0.01 h 3.55 3.75 0.14 0.148 h b d e a1 a2 a g c 4.00 (0.157) 0.57 (0.022) 2.70 (0.106) 0.65 (0.026) 0.65 (0.026)
package information bat48 6/8 doc id 12634 rev 2 figure 10. sod-323 footprint (dimensions in mm) table 7. sod-323 dimensions ref. dimensions millimeters inches min. max. min. max. a 1.17 0.046 a1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 d 1.52 1.8 0.06 0.071 e 1.11 1.45 0.044 0.057 h 2.3 2.7 0.09 0.106 l 0.1 0.46 0.004 0.02 q1 0.1 0.41 0.004 0.016 table 8. do-35 dimensions ref. dimensions millimeters inches min. max. min. max. a 3.05 4.50 0.120 0.177 b 1.53 2.00 0.060 0.079 c 12.7 0.500 d 0.458 0.558 0.018 0.022 h b d e a1 a l q1 c 3.20 0.54 1.08 1.06 1.06 ?b ?d a cc
bat48 ordering information doc id 12634 rev 2 7/8 3 ordering information 4 revision history table 9. ordering information order code marking package weight base qty delivery mode BAT48ZFILM z48 sod-123 single 10 mg 3000 tape and reel bat48jfilm 48 sod-323 single 5 mg 3000 tape and reel bat48rl bat48 do-35 15 mg 4000 tape and reel table 10. document revision history date revision changes 08-aug-2006 1 initial release. 07-jul-2011 2 updated package information for sod-123. added do-35 package.
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